Tungsten Sputter target
Tungsten targets are a flat, polished piece. There are no holes or
grooves in them. Usually they are made in the form of a thick disk or
the thinnest plate. Dimensions and manufacturing accuracy affect what
the final price of tungsten targets will be.
tungsten sputtering targets
There is another variety of these parts - tungsten sputtering targets.
Their shape resembles a disk with a cut deep chamfer and a hole in the
middle. Their name comes from the process in which they are used. With
their help, complex semiconductor parts are manufactured by diffusion
sputtering, and tungsten itself plays the role of an inert layer between
the future silicon core and the metal body. The metal most often used is
aluminum, which does not adhere to tungsten at all..
.
Tungsten
Cobalt
Iron
Carbon
Sulfur
Copper
Zinc
Lead
Total Impurities
99.99
<0.00002
0.002
<0.01
0.0002
0.00005
0.00005
0.00002
<0.01
Diam
thickness
length
width
purity
Details
Foil
0.03mm -0.8mm
>3000mm
2mm-150mm
99.99%
Details
sheet
0.03mm-50mm
100mm
100mm
99.99%
Details
wire
0.025mm
-0.05mm
7000-8000m
99.99%
Details
Stab
2.0mm
-150mm
<1000mm
99.99%
Details
powder
50nm- 20μm
99.99%
Details
Pellets
6mm-13mm
99.99%
Details
granules
6mm-13mm
99.99%
Details
Sputter
target
3mm-300mm
O30--2000mm
99.99%
Details
crucible
30ml-50ml
99.9%
Details
mesh
0.05-2mm
hole:0.3X0.6mm, 0.5X1mm
............20X40mm
99.9%
Details
foam
0.3-10mm
100mm
100mm
Details
Tungsten targets are a flat, polished piece. There are no holes or
grooves in them. Usually they are made in the form of a thick disk or
the thinnest plate. Dimensions and manufacturing accuracy affect what
the final price of tungsten targets will be.
tungsten sputtering targets
There is another variety of these parts - tungsten sputtering targets.
Their shape resembles a disk with a cut deep chamfer and a hole in the
middle. Their name comes from the process in which they are used. With
their help, complex semiconductor parts are manufactured by diffusion
sputtering, and tungsten itself plays the role of an inert layer between
the future silicon core and the metal body. The metal most often used is
aluminum, which does not adhere to tungsten at all..
.
| Tungsten | Cobalt | Iron | Carbon | Sulfur | Copper | Zinc | Lead | Total Impurities | ||
|---|---|---|---|---|---|---|---|---|---|---|
| 99.99 | <0.00002 | 0.002 | <0.01 | 0.0002 | 0.00005 | 0.00005 | 0.00002 | <0.01 |
| Diam | thickness | length | width | purity | Details | ||
|---|---|---|---|---|---|---|---|
|
|
Foil | 0.03mm -0.8mm | >3000mm | 2mm-150mm | 99.99% | Details | |
|
|
sheet | 0.03mm-50mm | 100mm | 100mm | 99.99% | Details | |
|
|
wire | 0.025mm -0.05mm |
7000-8000m | 99.99% | Details | ||
|
|
Stab | 2.0mm -150mm |
<1000mm | 99.99% | Details | ||
|
|
powder | 50nm- 20μm | 99.99% | Details | |||
|
|
Pellets | 6mm-13mm | 99.99% | Details | |||
|
|
granules | 6mm-13mm | 99.99% | Details | |||
|
|
Sputter target |
3mm-300mm | O30--2000mm | 99.99% | Details | ||
|
|
crucible | 30ml-50ml | 99.9% | Details | |||
|
|
mesh | 0.05-2mm | hole:0.3X0.6mm, 0.5X1mm ............20X40mm |
99.9% | Details | ||
|
|
foam | 0.3-10mm | 100mm | 100mm | Details | ||